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SSTUAF32868AHLF vs SSTUA32S865ET,557 feature comparison

SSTUAF32868AHLF Integrated Device Technology Inc

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SSTUA32S865ET,557 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code CABGA BGA
Package Description LEAD FREE, MO-246, LFBGA-176 TFBGA, BGA160,12X18,25
Pin Count 176 160
Manufacturer Package Code BKG176 SOT802-2
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 32868 SSTU
JESD-30 Code R-PBGA-B176 R-PBGA-B160
JESD-609 Code e1 e0
Length 15 mm 13 mm
Logic IC Type BUS DRIVER D FLIP-FLOP
Moisture Sensitivity Level 3
Number of Bits 28 28
Number of Functions 1 1
Number of Terminals 176 160
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA176,8X22,25 BGA160,12X18,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 3 ns 1.8 ns
Seated Height-Max 1.55 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.9 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 6 mm 9 mm
Base Number Matches 4 1
Output Characteristics OPEN-DRAIN
Qualification Status Not Qualified
Technology CMOS
fmax-Min 450 MHz
Logic » FF/Latches
Logic » FF/Latches

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Compare SSTUA32S865ET,557 with alternatives