SSTVF16859BS,157 vs ICSSSTVF16859BYG-T feature comparison

SSTVF16859BS,157 NXP Semiconductors

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ICSSSTVF16859BYG-T Integrated Device Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFN TSSOP
Package Description HVQCCN, LCC56,.31SQ,20 TSSOP,
Pin Count 56 64
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTV SSTV
JESD-30 Code S-PQCC-N56 R-PDSO-G64
JESD-609 Code e4 e0
Length 8 mm 17 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 1
Number of Bits 13 13
Number of Functions 1 1
Number of Terminals 56 64
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN TSSOP
Package Equivalence Code LCC56,.31SQ,20 TSSOP64,.32,20
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 2.5 ns 2.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.2 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 8 mm 6.1 mm
fmax-Min 210 MHz 210 MHz
Base Number Matches 1 1
Pbfree Code No

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