ST1G3234BBJR vs ST1G3234BJR feature comparison

ST1G3234BBJR STMicroelectronics

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ST1G3234BJR STMicroelectronics

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code FLIP-CHIP BGA
Package Description FLIP-CHIP-5 ROHS COMPLIANT, FLIP CHIP, 5 PIN
Pin Count 5 5
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Interface IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 Code R-PBGA-B5 R-PBGA-B5
Length 1.36 mm 1.36 mm
Number of Functions 1 1
Number of Terminals 5 5
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA5,3X3,17/10 BGA5,3X3,20/10
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.714 mm 0.715 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.4 V 1.4 V
Supply Voltage-Nom 3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Width 1.02 mm 1.02 mm
Base Number Matches 1 1
Pbfree Code Yes
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER