ST68C454CJ68
vs
XR16V654IV
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
EXAR CORP
|
EXAR CORP
|
| Part Package Code |
LCC
|
QFP
|
| Package Description |
QCCJ, LDCC68,1.0SQ
|
10 X 10 MM, 1.40 MM HEIGHT, LQFP-64
|
| Pin Count |
68
|
64
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO OPERATES AT 3.3V SUPPLY
|
ALSO OPERATES AT 2.5V SUPPLY @ 50MHZ
|
| Address Bus Width |
5
|
3
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
24 MHz
|
64 MHz
|
| Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
| Data Transfer Rate-Max |
0.1875 MBps
|
2 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-J68
|
S-PQFP-G64
|
| JESD-609 Code |
e0
|
|
| Length |
24.2316 mm
|
10 mm
|
| Number of Serial I/Os |
4
|
4
|
| Number of Terminals |
68
|
64
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
LFQFP
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
QFP64,.47SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
1.6 mm
|
| Supply Voltage-Max |
5.5 V
|
3.63 V
|
| Supply Voltage-Min |
4.5 V
|
2.97 V
|
| Supply Voltage-Nom |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.2316 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
2
|
1
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare ST68C454CJ68 with alternatives
Compare XR16V654IV with alternatives