STA2058EXA
vs
STA2058EX
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA,
|
LFBGA,
|
Pin Count |
144
|
144
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
Length |
10 mm
|
10 mm
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Supply Voltage-Max |
3.63 V
|
3.63 V
|
Supply Voltage-Min |
2.97 V
|
2.97 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
10 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
Base Number Matches |
2
|
4
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare STA2058EXA with alternatives
Compare STA2058EX with alternatives