STB18NM80
vs
SPW17N80C3FKSA1
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
STMICROELECTRONICS
|
INFINEON TECHNOLOGIES AG
|
Part Package Code |
D2PAK
|
TO-247
|
Package Description |
ROHS COMPLIANT, TO-263, D2PAK-3
|
FLANGE MOUNT, R-PSFM-T3
|
Pin Count |
4
|
3
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Factory Lead Time |
13 Weeks
|
4 Weeks
|
Samacsys Manufacturer |
STMicroelectronics
|
Infineon
|
Avalanche Energy Rating (Eas) |
600 mJ
|
670 mJ
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
800 V
|
800 V
|
Drain Current-Max (ID) |
17 A
|
17 A
|
Drain-source On Resistance-Max |
0.295 Ω
|
0.29 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-263AB
|
TO-247
|
JESD-30 Code |
R-PSSO-G2
|
R-PSFM-T3
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
245
|
260
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
190 W
|
|
Pulsed Drain Current-Max (IDM) |
68 A
|
51 A
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin (Sn)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Position |
SINGLE
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Additional Feature |
|
AVALANCHE RATED, HIGH VOLTAGE
|
|
|
|
Compare STB18NM80 with alternatives
Compare SPW17N80C3FKSA1 with alternatives