STD10P6F6
vs
SPD08P06P
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
INFINEON TECHNOLOGIES AG
|
Package Description |
DPAK-3/2
|
ROHS COMPLIANT, TO-252, 3 PIN
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Factory Lead Time |
16 Weeks, 3 Days
|
|
Samacsys Manufacturer |
STMicroelectronics
|
Infineon
|
Avalanche Energy Rating (Eas) |
80 mJ
|
70 mJ
|
Case Connection |
DRAIN
|
DRAIN
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
60 V
|
60 V
|
Drain Current-Max (ID) |
10 A
|
8.83 A
|
Drain-source On Resistance-Max |
0.116 Ω
|
0.3 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-252
|
TO-252AA
|
JESD-30 Code |
R-PSSO-G2
|
R-PSSO-G2
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
3
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
Power Dissipation-Max (Abs) |
35 W
|
42 W
|
Pulsed Drain Current-Max (IDM) |
40 A
|
35.32 A
|
Surface Mount |
NO
|
YES
|
Terminal Finish |
Matte Tin (Sn)
|
TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
SINGLE
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Transistor Application |
SWITCHING
|
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
TO-252AA
|
Pin Count |
|
4
|
Additional Feature |
|
AVALANCHE RATED
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare STD10P6F6 with alternatives
Compare SPD08P06P with alternatives