STH240N75F3-6
vs
BUK6C3R3-75C
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
Transferred
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NXP SEMICONDUCTORS
|
| Package Description |
ROHS COMPLIANT, H2PAK-7/6
|
SMALL OUTLINE, R-PSSO-G6
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
26 Weeks
|
|
| Samacsys Manufacturer |
STMicroelectronics
|
NXP
|
| Avalanche Energy Rating (Eas) |
600 mJ
|
560 mJ
|
| Case Connection |
DRAIN
|
DRAIN
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
75 V
|
75 V
|
| Drain Current-Max (ID) |
180 A
|
181 A
|
| Drain-source On Resistance-Max |
0.003 Ω
|
0.0051 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-30 Code |
R-PSSO-G6
|
R-PSSO-G6
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
175 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
300 W
|
|
| Pulsed Drain Current-Max (IDM) |
720 A
|
723 A
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
D2PAK
|
| Pin Count |
|
7/6
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Reference Standard |
|
AEC-Q101; IEC-60134
|
| Terminal Finish |
|
TIN
|
|
|
|
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