STM32F405OGY6WTR
vs
STM32F405RGT6W
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Manufacturer Package Code |
WLCSP 90 BALLS DIE 413 P 0.4 MM
|
LQFP 64 10x10x1.4
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
15 Weeks
|
15 Weeks
|
Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
CPU Family |
CORTEX-M4
|
CORTEX-M4
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
R-XBGA-B90
|
S-PQFP-G64
|
Length |
4.223 mm
|
10 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
16
|
16
|
Number of External Interrupts |
16
|
16
|
Number of I/O Lines |
72
|
51
|
Number of Serial I/Os |
6
|
6
|
Number of Terminals |
90
|
64
|
Number of Timers |
14
|
14
|
On Chip Data RAM Width |
8
|
8
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Code |
VFBGA
|
LFQFP
|
Package Equivalence Code |
BGA90,9X10,16
|
QFP64,.47SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
RAM (bytes) |
200704
|
200704
|
ROM (words) |
1048576
|
1048576
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
0.6 mm
|
1.6 mm
|
Speed |
168 MHz
|
168 MHz
|
Supply Current-Max |
117 mA
|
117 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3.3 V
|
3.3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
3.969 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Package Body Material |
|
PLASTIC/EPOXY
|
Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare STM32F405OGY6WTR with alternatives
Compare STM32F405RGT6W with alternatives