SX8651ICSTRT
vs
SX8651IWLTRT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SEMTECH CORP
|
SEMTECH CORP
|
| Part Package Code |
BGA
|
DFN
|
| Package Description |
VFBGA,
|
DFN-12
|
| Pin Count |
12
|
12
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
SEMTECH
|
SEMTECH
|
| JESD-30 Code |
R-PBGA-B12
|
S-PDSO-N12
|
| JESD-609 Code |
e4
|
e3
|
| Length |
2 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
12
|
12
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HVSON
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.625 mm
|
0.8 mm
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.45 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
1.5 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare SX8651ICSTRT with alternatives
Compare SX8651IWLTRT with alternatives