SY100E151JI-TR
vs
MC100E151FN
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
PLASTIC, LCC-28
|
QCCJ, LDCC28,.5SQ
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Family |
100E
|
|
| JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
11.48 mm
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
6
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Packing Method |
TR
|
|
| Propagation Delay (tpd) |
0.8 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL100K
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Trigger Type |
POSITIVE EDGE
|
MASTER-SLAVE
|
| Width |
11.48 mm
|
|
| fmax-Min |
1100 MHz
|
|
| Base Number Matches |
1
|
5
|
| Max Frequency@Nom-Sup |
|
1100000000 Hz
|
| Package Equivalence Code |
|
LDCC28,.5SQ
|
| Power Supplies |
|
-4.5 V
|
| Power Supply Current-Max (ICC) |
|
90 mA
|
|
|
|
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