SY100EP111UTG-TR
vs
CDCLVP111RHBT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
TQFP,
|
QFN-32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
25 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
Texas Instruments
|
| Additional Feature |
LVECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V
|
LVECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V; ALSO OPERATES AT 3.3 V SUPPLY
|
| Family |
100EP
|
111
|
| Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQCC-N32
|
| Length |
7 mm
|
5 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
32
|
32
|
| Number of True Outputs |
20
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TQFP
|
HVQCCN
|
| Package Equivalence Code |
TQFP32,.35SQ,32
|
LCC32,.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR
|
TR
|
| Power Supply Current-Max (ICC) |
120 mA
|
85 mA
|
| Propagation Delay (tpd) |
0.4 ns
|
0.35 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.025 ns
|
0.03 ns
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
3.8 V
|
3.8 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
5 mm
|
| fmax-Min |
3 MHz
|
3500 MHz
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
32
|
| JESD-609 Code |
|
e4
|
| Max I(ol) |
|
0.005 A
|
| Moisture Sensitivity Level |
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
0.35 ns
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SY100EP111UTG-TR with alternatives
Compare CDCLVP111RHBT with alternatives