SY100EP195VTG-TR
vs
SY89295UTG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TQFP-32
|
TQFP-32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
8 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Additional Feature |
NECL MODE: VCC=0 WITH VEE= -3.0V TO -5.5V
|
ALSO OPERATES WITH 3.3V NOMINAL SUPPLY VOLTAGE
|
| Family |
100E
|
CMOS
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
| JESD-609 Code |
e4
|
e4
|
| Length |
7 mm
|
7 mm
|
| Logic IC Type |
ACTIVE DELAY LINE
|
ACTIVE DELAY LINE
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Taps/Steps |
1023
|
1023
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TQFP
|
TQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE
|
FLATPACK, THIN PROFILE
|
| Packing Method |
TR
|
TRAY
|
| Programmable Delay Line |
YES
|
YES
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Total Delay-Nom (td) |
12.2 ns
|
|
| Width |
7 mm
|
7 mm
|
| Base Number Matches |
2
|
3
|
|
|
|
Compare SY100EP195VTG-TR with alternatives
Compare SY89295UTG with alternatives