SY100H607JC
vs
MC100H607FNR2G
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ONSEMI
|
Package Description |
PLCC-28
|
LEAD FREE, PLASTIC, LCC-28
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Input Characteristics |
DIFFERENTIAL
|
|
Interface IC Type |
PECL TO TTL TRANSLATOR
|
PECL TO TTL TRANSLATOR
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
Length |
11.48 mm
|
11.505 mm
|
Number of Bits |
6
|
1
|
Number of Functions |
1
|
6
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Output Latch or Register |
REGISTER
|
REGISTER
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Current-Max |
120 mA
|
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.48 mm
|
11.505 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
QLCC
|
Pin Count |
|
28
|
Manufacturer Package Code |
|
776-02
|
Factory Lead Time |
|
4 Weeks
|
JESD-609 Code |
|
e3
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
TIN
|
|
|
|
Compare SY100H607JC with alternatives
Compare MC100H607FNR2G with alternatives