SY100S325FC
vs
SY100S325JC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
MICREL INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFF, QFL24,.4SQ
|
PLCC-28
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Delay-Max |
3.7 ns
|
3.7 ns
|
| Interface IC Type |
ECL TO TTL TRANSLATOR
|
ECL TO TTL TRANSLATOR
|
| JESD-30 Code |
S-GQFP-F24
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.78 mm
|
11.48 mm
|
| Number of Bits |
1
|
1
|
| Number of Functions |
6
|
6
|
| Number of Terminals |
24
|
28
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Output Latch or Register |
NONE
|
NONE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
QFF
|
QCCJ
|
| Package Equivalence Code |
QFL24,.4SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.29 mm
|
4.57 mm
|
| Supply Current-Max |
65 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
FLAT
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
9.78 mm
|
11.48 mm
|
| Base Number Matches |
3
|
2
|
|
|
|
Compare SY100S325FC with alternatives
Compare SY100S325JC with alternatives