SY100S360JZ
vs
100360FMQB
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
LEAD FREE, PLASTIC, LCC-28
|
QFF, QFL24,.4SQ
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
100S
|
100K
|
| JESD-30 Code |
S-PQCC-J28
|
S-GQFP-F24
|
| JESD-609 Code |
e3
|
e0
|
| Length |
11.48 mm
|
|
| Logic IC Type |
PARITY GENERATOR/CHECKER
|
PARITY GENERATOR/CHECKER
|
| Number of Bits |
9
|
9
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
28
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCJ
|
QFF
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
2.2 ns
|
2.95 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2.159 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
J BEND
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
11.48 mm
|
|
| Base Number Matches |
3
|
1
|
| Rohs Code |
|
No
|
| Additional Feature |
|
EVEN PARITY GENERATOR
|
| Load Capacitance (CL) |
|
3 pF
|
| Output Characteristics |
|
OPEN-EMITTER
|
| Package Equivalence Code |
|
QFL24,.4SQ
|
| Power Supply Current-Max (ICC) |
|
110 mA
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare SY100S360JZ with alternatives
Compare 100360FMQB with alternatives