SY100S360JZ
vs
SY100S366FC
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICREL INC
|
Package Description |
LEAD FREE, PLASTIC, LCC-28
|
QFF, QFL24,.4SQ
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
100S
|
100S
|
JESD-30 Code |
S-PQCC-J28
|
S-GQFP-F24
|
JESD-609 Code |
e3
|
e0
|
Length |
11.48 mm
|
9.78 mm
|
Logic IC Type |
PARITY GENERATOR/CHECKER
|
MAGNITUDE COMPARATOR
|
Number of Bits |
9
|
9
|
Number of Functions |
2
|
1
|
Number of Terminals |
28
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Output Polarity |
TRUE
|
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
QCCJ
|
QFF
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Propagation Delay (tpd) |
2.2 ns
|
1.6 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
2.29 mm
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
11.48 mm
|
9.78 mm
|
Base Number Matches |
3
|
3
|
Rohs Code |
|
No
|
Part Package Code |
|
QFP
|
Pin Count |
|
24
|
Package Equivalence Code |
|
QFL24,.4SQ
|
Power Supply Current-Max (ICC) |
|
120 mA
|
|
|
|
Compare SY100S360JZ with alternatives
Compare SY100S366FC with alternatives