SY10E112JCTR
vs
SY10E112JY
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICREL INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
QCCJ, LDCC28,.5SQ
|
LCC-28
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
10E
|
10E
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e3
|
Length |
11.48 mm
|
11.48 mm
|
Logic IC Type |
INVERTER/BUFFER
|
INVERTER/BUFFER
|
Moisture Sensitivity Level |
1
|
2
|
Number of Functions |
4
|
4
|
Number of Inputs |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
240
|
|
Propagation Delay (tpd) |
0.6 ns
|
0.6 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
|
Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
MATTE TIN
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
11.48 mm
|
11.48 mm
|
Base Number Matches |
1
|
3
|
ECCN Code |
|
EAR99
|
Supply Voltage-Max (Vsup) |
|
-5.5 V
|
Supply Voltage-Min (Vsup) |
|
-4.2 V
|
Supply Voltage-Nom (Vsup) |
|
-5.2 V
|
|
|
|
Compare SY10E112JCTR with alternatives
Compare SY10E112JY with alternatives