SY10E150JC
vs
MC100E212FN
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
SYNERGY SEMICONDUCTOR CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
WITH DUAL LATCH ENABLE
|
|
Family |
10E
|
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e0
|
Logic IC Type |
D LATCH
|
BUS DRIVER
|
Number of Bits |
6
|
|
Number of Functions |
1
|
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Output Characteristics |
OPEN-EMITTER
|
|
Output Polarity |
COMPLEMENTARY
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Power Supply Current-Max (ICC) |
62 mA
|
|
Prop. Delay@Nom-Sup |
0.55 ns
|
|
Propagation Delay (tpd) |
0.7 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL100K
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Trigger Type |
LOW LEVEL
|
|
Base Number Matches |
4
|
4
|
Package Description |
|
QCCJ, LDCC28,.5SQ
|
Power Supplies |
|
-4.5 V
|
|
|
|