SY10E167JC
vs
MC10E167FNR2
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
SYNERGY SEMICONDUCTOR CORP
|
MOTOROLA INC
|
Package Description |
QCCJ, LDCC28,.5SQ
|
PLASTIC, LCC-28
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
SIX 2:1 MUX FOLLOWED BY REGISTER; WITH DUAL CLOCK
|
SIX 2:1 MUX FOLLOWED BY REGISTER; WITH DUAL CLOCK
|
Family |
10E
|
10E
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e0
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
1000000000 Hz
|
1000000000 Hz
|
Number of Bits |
6
|
6
|
Number of Functions |
1
|
1
|
Number of Inputs |
2
|
2
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Power Supply Current-Max (ICC) |
113 mA
|
113 mA
|
Prop. Delay@Nom-Sup |
0.8 ns
|
0.8 ns
|
Propagation Delay (tpd) |
0.8 ns
|
0.8 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
fmax-Min |
1000 MHz
|
1000 MHz
|
Base Number Matches |
3
|
4
|
HTS Code |
|
8542.39.00.01
|
Length |
|
11.505 mm
|
Packing Method |
|
TR
|
Seated Height-Max |
|
4.57 mm
|
Width |
|
11.505 mm
|
|
|
|