SY10EP53ZITR
vs
MC10E175FNR2
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICREL INC
|
MOTOROLA INC
|
| Part Package Code |
MSOP
|
|
| Package Description |
TSSOP,
|
PLASTIC, LCC-28
|
| Pin Count |
10
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
NECL MODE OPERATING RANGE: VCC=0V, VEE=-3V TO -5.5V
|
WITH PARITY GENERATION
|
| Family |
10E
|
10E
|
| JESD-30 Code |
S-PDSO-G10
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
|
| Length |
3 mm
|
11.505 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
COMPLEMENTARY
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Propagation Delay (tpd) |
0.35 ns
|
0.9 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
POSITIVE EDGE
|
LOW LEVEL
|
| Width |
3 mm
|
11.505 mm
|
| Base Number Matches |
2
|
3
|
| Output Characteristics |
|
OPEN-EMITTER
|
| Package Equivalence Code |
|
LDCC28,.5SQ
|
| Power Supply Current-Max (ICC) |
|
132 mA
|
|
|
|
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