SY10H602JZ
vs
MC10H602FN
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICREL INC
|
ON SEMICONDUCTOR
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
QCCJ, LDCC28,.5SQ
|
PLASTIC, LCC-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Delay-Max |
3.9 ns
|
3.2 ns
|
| Interface IC Type |
TTL TO ECL TRANSLATOR
|
TTL TO ECL TRANSLATOR
|
| JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
| JESD-609 Code |
e3
|
e0
|
| Length |
11.48 mm
|
11.505 mm
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of Bits |
1
|
1
|
| Number of Functions |
9
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Latch or Register |
LATCH
|
NONE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
235
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL10K
|
ECL10K
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
11.48 mm
|
11.505 mm
|
| Base Number Matches |
2
|
4
|
| Output Characteristics |
|
OPEN-EMITTER
|
|
|
|
Compare SY10H602JZ with alternatives
Compare MC10H602FN with alternatives