SY58011UMGTR vs ICS8535BGI-01 feature comparison

SY58011UMGTR Microchip Technology Inc

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ICS8535BGI-01 Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DFN TSSOP
Package Description HVQCCN, 4.40 X 6.50 MM, 0.925 MM HEIGHT, MO-153, TSSOP-20
Pin Count 16 20
Manufacturer Package Code MLF
Reach Compliance Code compliant not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO OPERATE WITH 3.3V SUPPLY
Family 58011 8535
Input Conditioning DIFFERENTIAL MUX
JESD-30 Code S-XQCC-N16 R-PDSO-G20
JESD-609 Code e4 e0
Length 3 mm 6.5 mm
Logic IC Type LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER
Moisture Sensitivity Level 2
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 16 20
Number of True Outputs 4 4
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVQCCN TSSOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Propagation Delay (tpd) 0.25 ns
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.015 ns
Seated Height-Max 0.95 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.465 V
Supply Voltage-Min (Vsup) 2.375 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD DUAL
Width 3 mm 4.4 mm
fmax-Min 7000 MHz
Base Number Matches 2 4

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