SY58011UMGTR
vs
ICS8535BGI-01
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
DFN
|
TSSOP
|
Package Description |
HVQCCN,
|
4.40 X 6.50 MM, 0.925 MM HEIGHT, MO-153, TSSOP-20
|
Pin Count |
16
|
20
|
Manufacturer Package Code |
MLF
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
CAN ALSO OPERATE WITH 3.3V SUPPLY
|
|
Family |
58011
|
8535
|
Input Conditioning |
DIFFERENTIAL
|
MUX
|
JESD-30 Code |
S-XQCC-N16
|
R-PDSO-G20
|
JESD-609 Code |
e4
|
e0
|
Length |
3 mm
|
6.5 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Moisture Sensitivity Level |
2
|
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
16
|
20
|
Number of True Outputs |
4
|
4
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
TSSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
|
Propagation Delay (tpd) |
0.25 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.015 ns
|
|
Seated Height-Max |
0.95 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
3 mm
|
4.4 mm
|
fmax-Min |
7000 MHz
|
|
Base Number Matches |
2
|
4
|
|
|
|
Compare SY58011UMGTR with alternatives
Compare ICS8535BGI-01 with alternatives