SY58019UMI
vs
SY58019UMITR
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICREL INC
|
| Part Package Code |
DFN
|
DFN
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
MLF
|
MLF
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| Package Description |
|
3 X 3 MM, MLF-16
|
| Additional Feature |
|
ALSO OPERATES WITH 3.3V SUPPLY
|
| Family |
|
58019
|
| JESD-30 Code |
|
S-XQCC-N16
|
| JESD-609 Code |
|
e0
|
| Length |
|
3 mm
|
| Moisture Sensitivity Level |
|
2
|
| Number of Functions |
|
1
|
| Number of Inputs |
|
2
|
| Number of Outputs |
|
1
|
| Number of Terminals |
|
16
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
|
COMPLEMENTARY
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Code |
|
HVQCCN
|
| Package Equivalence Code |
|
LCC16,.12SQ,20
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Propagation Delay (tpd) |
|
0.24 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
0.95 mm
|
| Supply Voltage-Max (Vsup) |
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
|
2.5 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
3 mm
|
|
|
|
Compare SY58019UMI with alternatives
Compare SY58019UMITR with alternatives