SY88823VEYTR vs SY88823VEY feature comparison

SY88823VEYTR Microchip Technology Inc

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SY88823VEY Microchip Technology Inc

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICREL INC MICROCHIP TECHNOLOGY INC
Part Package Code MSOP
Package Description HTSSOP, LEAD FREE, MSOP-10
Pin Count 10
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PDSO-G10 S-PDSO-G10
JESD-609 Code e3 e4
Length 3 mm 3 mm
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 10 10
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HTSSOP HTSSOP
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Telecom IC Type ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 3 mm 3 mm
Base Number Matches 2 1

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