SY89223LMITR
vs
MC100ELT23D
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICREL INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
DFN
|
|
| Package Description |
HVSON, SOLCC8,.08,20
|
SOP, SOP8,.25
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
MLF
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Delay-Max |
2.5 ns
|
|
| Interface IC Type |
PECL TO TTL TRANSLATOR
|
ECL TO TTL TRANSLATOR
|
| JESD-30 Code |
S-XDSO-N8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
2 mm
|
|
| Moisture Sensitivity Level |
2
|
|
| Number of Bits |
1
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Latch or Register |
NONE
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
SOP
|
| Package Equivalence Code |
SOLCC8,.08,20
|
SOP8,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9754 mm
|
|
| Supply Voltage-Max |
3.6 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Supply Voltage-Nom |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL100K
|
ECL100K
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
2 mm
|
|
| Base Number Matches |
2
|
4
|
| Power Supplies |
|
5 V
|
|
|
|
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