SY89465UMY
vs
SY89465UMG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
MLF-44
|
7 X 7 MM, LEAD FREE, MO-220, MLF-44
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A991.B.1
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
16 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Family |
89465
|
89645
|
| Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
S-XQCC-N44
|
S-XQCC-N44
|
| JESD-609 Code |
e3
|
e4
|
| Length |
7 mm
|
7 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
44
|
44
|
| Number of True Outputs |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TRAY
|
|
| Propagation Delay (tpd) |
1.2 ns
|
1.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.025 ns
|
0.025 ns
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
7 mm
|
| fmax-Min |
1500 MHz
|
1500 MHz
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare SY89465UMY with alternatives
Compare SY89465UMG with alternatives