SY89826LHY-TR
vs
MC100EP223TC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
HTFQFP,
|
HLFQFP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
21 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Family |
89826
|
100E
|
| Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
| JESD-609 Code |
e3
|
|
| Length |
10 mm
|
10 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
64
|
64
|
| Number of True Outputs |
22
|
22
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
HLFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
| Packing Method |
TR
|
|
| Propagation Delay (tpd) |
1.45 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.075 ns
|
0.05 ns
|
| Seated Height-Max |
1.2 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
10 mm
|
| fmax-Min |
1000 MHz
|
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
64
|
| Technology |
|
ECL
|
|
|
|
Compare SY89826LHY-TR with alternatives
Compare MC100EP223TC with alternatives