T8172-TB7-T
vs
TDA4864AJ
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
UNISONIC TECHNOLOGIES CO LTD
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SFM
|
ZFM
|
| Package Description |
,
|
ZIP, ZIP7,.2,.1TB
|
| Pin Count |
3
|
7
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Application |
TV; MONITOR
|
|
| Blanking Output |
NO
|
NO
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| JESD-30 Code |
R-XZFM-T7
|
R-PZFM-T7
|
| JESD-609 Code |
e0
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
7
|
7
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
ZIG-ZAG
|
ZIG-ZAG
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Operating Temperature-Max |
|
75 °C
|
| Operating Temperature-Min |
|
-20 °C
|
| Package Code |
|
ZIP
|
| Package Equivalence Code |
|
ZIP7,.2,.1TB
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Supply Voltage-Max (Vsup) |
|
30 V
|
| Supply Voltage-Min (Vsup) |
|
9 V
|
| Technology |
|
BIPOLAR
|
| Temperature Grade |
|
COMMERCIAL EXTENDED
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare T8172-TB7-T with alternatives
Compare TDA4864AJ with alternatives