TA31136FNG vs TA31136F(ER) feature comparison

TA31136FNG Toshiba America Electronic Components

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TA31136F(ER) Toshiba America Electronic Components

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description LSSOP, SSOP16,.25 SSOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 5 mm 8.2 mm
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -30 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP SSOP
Package Equivalence Code SSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.9 mm
Supply Current-Max 4.6 mA 4.6 mA
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Temperature Grade OTHER OTHER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm 4.6 mm
Base Number Matches 1 1

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