TA31136FNG
vs
TA31136FN
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TOSHIBA CORP
|
TOSHIBA CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
LSSOP, SSOP16,.25
|
LSSOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
Length |
5 mm
|
5 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-30 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSSOP
|
LSSOP
|
Package Equivalence Code |
SSOP16,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Supply Current-Max |
4.6 mA
|
4.6 mA
|
Supply Voltage-Nom |
2 V
|
2 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Telecom IC Type |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
1
|
6
|
Samacsys Manufacturer |
|
Toshiba
|
|
|
|
Compare TA31136FNG with alternatives
Compare TA31136FN with alternatives