TAS2553YFFR
vs
TAS2564YBGT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
DSBGA-30
|
VFBGA, BGA36,6X6,16
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Bandwidth-Nom |
20 kHz
|
20 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
Gain |
15 dB
|
|
JESD-30 Code |
R-PBGA-B30
|
R-PBGA-B36
|
JESD-609 Code |
e1
|
e1
|
Length |
2.855 mm
|
2.634 mm
|
Moisture Sensitivity Level |
1
|
1
|
Noise Figure-Nom |
94 dB
|
110 dB
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
30
|
36
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
2.8 W
|
7 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA30,5X6,16
|
BGA36,6X6,16
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.625 mm
|
0.5 mm
|
Supply Current-Max |
30 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2.575 mm
|
2.464 mm
|
Base Number Matches |
1
|
1
|
Date Of Intro |
|
2019-12-21
|
|
|
|
Compare TAS2553YFFR with alternatives
Compare TAS2564YBGT with alternatives