TAS5611PHDR
vs
TAS5612LADDV
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFP
|
SSOP
|
| Package Description |
HTQFP,
|
HSSOP-44
|
| Pin Count |
64
|
44
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
| JESD-30 Code |
S-PQFP-G64
|
R-PDSO-G44
|
| JESD-609 Code |
e4
|
e4
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
44
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
|
| Output Power-Nom |
130 W
|
125 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTQFP
|
HTSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
13.2 V
|
13.2 V
|
| Supply Voltage-Min (Vsup) |
10.8 V
|
10.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
14 mm
|
6.1 mm
|
| Base Number Matches |
1
|
2
|
| Gain |
|
36 dB
|
| Noise Figure-Nom |
|
105 dB
|
| Package Equivalence Code |
|
TSSOP44,.33
|
|
|
|
Compare TAS5611PHDR with alternatives
Compare TAS5612LADDV with alternatives