TB31261AF vs MC13110AFBR2 feature comparison

TB31261AF Toshiba America Electronic Components

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MC13110AFBR2 Motorola Mobility LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP MOTOROLA INC
Part Package Code QFP QFP
Package Description QFP, QFP52,.52SQ QFP,
Pin Count 52 52
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G52 S-PQFP-G52
Length 10 mm 10 mm
Number of Functions 1 1
Number of Terminals 52 52
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Equivalence Code QFP52,.52SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.45 mm 2.45 mm
Supply Current-Max 0.0333 mA 10.5 mA
Supply Voltage-Nom 3.6 V 3.6 V
Surface Mount YES YES
Technology BICMOS
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10 mm 10 mm
Base Number Matches 1 1

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