TC02G1072AC vs RP73F1E10K7ATDG feature comparison

TC02G1072AC Fenghua (HK) Electronics Ltd

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RP73F1E10K7ATDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer FENGHUA ADVANCED TECHNOLOGY TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.3 mm 0.3 mm
Package Length 1 mm 1 mm
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method BULK TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.0625 W 0.063 W
Rated Temperature 70 °C 70 °C
Resistance 10700 Ω 10700 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.05% 0.05%
Working Voltage 25 V 25 V
Base Number Matches 1 1
Additional Feature HIGH PRECISION
Manufacturer Series RP73
Package Shape RECTANGULAR PACKAGE
Reference Standard MIL-STD-202
Series RP73

Compare TC02G1072AC with alternatives

Compare RP73F1E10K7ATDG with alternatives