TC02G38R3AC vs RP73F1E38R3BTDF feature comparison

TC02G38R3AC Fenghua (HK) Electronics Ltd

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RP73F1E38R3BTDF TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer FENGHUA ADVANCED TECHNOLOGY TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8533.21.00.30
Construction Rectangular Rectangular
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.3 mm 0.3 mm
Package Length 1 mm 1 mm
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method BULK TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.0625 W 0.063 W
Rated Temperature 70 °C 70 °C
Resistance 38.3 Ω 38.3 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.05% 0.1%
Working Voltage 25 V 25 V
Base Number Matches 1 1
JESD-609 Code e3
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier

Compare TC02G38R3AC with alternatives

Compare RP73F1E38R3BTDF with alternatives