TC1044SEPA
vs
LM2660-MWC
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
DIE,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
6 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
Texas Instruments
|
| Analog IC - Other Type |
SWITCHED CAPACITOR REGULATOR
|
SWITCHED CAPACITOR CONVERTER
|
| Input Voltage-Max |
12 V
|
5.5 V
|
| Input Voltage-Min |
1.5 V
|
1.5 V
|
| Input Voltage-Nom |
5 V
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-XUUC-N
|
| JESD-609 Code |
e3
|
|
| Length |
9.5 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Voltage-Max |
-12 V
|
11 V
|
| Output Voltage-Min |
-1.5 V
|
-5.5 V
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP8,.3
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max (Isup) |
0.18 mA
|
|
| Surface Mount |
NO
|
YES
|
| Switcher Configuration |
DOUBLER INVERTER
|
|
| Switching Frequency-Max |
45 kHz
|
40 kHz
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
1
|
| Number of Outputs |
|
1
|
| Output Current-Max |
|
0.1 A
|
|
|
|
Compare TC1044SEPA with alternatives
Compare LM2660-MWC with alternatives