TC1410NEUA713 vs TC1410NCPA feature comparison

TC1410NEUA713 Microchip Technology Inc

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TC1410NCPA Telcom Semiconductor Inc

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC TELCOM SEMICONDUCTOR INC
Part Package Code TSSOP
Package Description TSSOP, TSSOP8,.19 DIP, DIP8,.3
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 5 Weeks
Samacsys Manufacturer Microchip
High Side Driver YES NO
Input Characteristics SCHMITT TRIGGER SCHMITT TRIGGER
Interface IC Type BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 Code S-PDSO-G8 R-PDIP-T8
JESD-609 Code e3 e0
Length 3 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Characteristics TOTEM-POLE TOTEM-POLE
Output Peak Current Limit-Nom 0.5 A 0.5 A
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Equivalence Code TSSOP8,.19 DIP8,.3
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Screening Level TS 16949
Seated Height-Max 1.1 mm
Supply Current-Max 1 mA
Supply Voltage-Max 16 V
Supply Voltage-Min 4.5 V
Supply Voltage1-Max 16 V
Supply Voltage1-Min 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Turn-off Time 0.085 µs 0.045 µs
Turn-on Time 0.085 µs 0.045 µs
Width 3 mm
Base Number Matches 1 2

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