TC1411VUA713
vs
TC1412EPA
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TELCOM SEMICONDUCTOR INC
|
| Package Description |
MSOP-8
|
PLASTIC, DIP-8
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
6 Weeks
|
|
| High Side Driver |
YES
|
NO
|
| Input Characteristics |
SCHMITT TRIGGER
|
SCHMITT TRIGGER
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
3 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
TOTEM-POLE
|
TOTEM-POLE
|
| Output Peak Current Limit-Nom |
1 A
|
2 A
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
DIP
|
| Package Equivalence Code |
TSSOP8,.19
|
DIP8,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Current-Max |
1 mA
|
|
| Supply Voltage-Max |
16 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage1-Max |
16 V
|
|
| Supply Voltage1-Min |
4.5 V
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Turn-off Time |
0.085 µs
|
0.05 µs
|
| Turn-on Time |
0.085 µs
|
0.05 µs
|
| Width |
3 mm
|
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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