TC4001BP vs HEF4001BPN feature comparison

TC4001BP Toshiba America Electronic Components

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HEF4001BPN NXP Semiconductors

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Pbfree Code Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description 0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba NXP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.25 mm 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.012 A 0.00035999999999999997 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.03 mA
Prop. Delay@Nom-Sup 200 ns 120 ns
Propagation Delay (tpd) 200 ns 120 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 4.45 mm 4.2 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 4 1
JESD-609 Code e4
Terminal Finish NICKEL PALLADIUM GOLD

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