TC4011UBFN(TP2) vs HEF4011BT,652 feature comparison

TC4011UBFN(TP2) Toshiba America Electronic Components

Buy Now Datasheet

HEF4011BT,652 NXP Semiconductors

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, PLASTIC, SO-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 110 ns 110 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 2
Manufacturer Package Code SOT108-1
ECCN Code EAR99
Samacsys Manufacturer NXP
Max I(ol) 0.00035999999999999997 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 110 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) 30

Compare TC4011UBFN(TP2) with alternatives

Compare HEF4011BT,652 with alternatives