TC4013BP vs HEC4013BT feature comparison

TC4013BP Toshiba America Electronic Components

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HEC4013BT NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-14 PLASTIC, SOT-108, SO-14
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.25 mm 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 3500000 Hz
Max I(ol) 0.012 A
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Power Supply Current-Max (ICC) 0.12 mA
Prop. Delay@Nom-Sup 300 ns
Propagation Delay (tpd) 300 ns 220 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 1.75 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 3.9 mm
fmax-Min 12 MHz 20 MHz
Base Number Matches 1 2
JESD-609 Code e4
Moisture Sensitivity Level 1
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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