TC4013BP vs HEF4013BPN feature comparison

TC4013BP Toshiba America Electronic Components

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HEF4013BPN Philips Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-14
Pin Count 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.25 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 3500000 Hz 7000000 Hz
Max I(ol) 0.012 A 0.00035999999999999997 A
Number of Bits 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.12 mA
Prop. Delay@Nom-Sup 300 ns 220 ns
Propagation Delay (tpd) 300 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm
fmax-Min 12 MHz
Base Number Matches 1 2
JESD-609 Code e4
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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