TC40175BP vs MC14175BFELG feature comparison

TC40175BP Toshiba America Electronic Components

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MC14175BFELG onsemi

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP ON SEMICONDUCTOR
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code unknown compliant
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-PDSO-G16
JESD-609 Code e0 e4
Length 19.25 mm 10.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 340 ns 400 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 2.05 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 5.275 mm
fmax-Min 3.5 MHz 6.5 MHz
Base Number Matches 1 1
Pbfree Code Yes
HTS Code 8542.39.00.01
Max Frequency@Nom-Sup 2000000 Hz
Moisture Sensitivity Level 3
Package Equivalence Code SOP16,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare TC40175BP with alternatives

Compare MC14175BFELG with alternatives