TC4050BFN(TP2) vs CD4010MN feature comparison

TC4050BFN(TP2) Toshiba America Electronic Components

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CD4010MN Texas Instruments

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IOH = 1.9MA @ VOH = 2.5V; IOL = 2.9MA @ VOL = 0.4V; WITH EXTENDED INPUT VOLTAGE DUAL SUPPLY HIGH TO LOW VOLTAGE TRANSLATOR
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-PDIP-T16
Length 9.9 mm 19.305 mm
Load Capacitance (CL) 50 pF 15 pF
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 70 ns 55 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
JESD-609 Code e0
Max I(ol) 0.0021000000000000003 A
Output Characteristics OPEN-DRAIN
Package Equivalence Code DIP16,.3
Prop. Delay@Nom-Sup 80 ns
Schmitt Trigger NO
Terminal Finish TIN LEAD

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