TC4050BFN(TP2)
vs
CD4050BMW
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
DFP
|
| Package Description |
SOP,
|
DFP, DIP16,.3
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
IOH = 1.9MA @ VOH = 2.5V; IOL = 2.9MA @ VOL = 0.4V; WITH EXTENDED INPUT VOLTAGE
|
IOH = 0.72MA @ VOH = 4.6V; IOL = 3.2MA @ VOL = 0.4V; WITH EXTENDED INPUT VOLTAGE
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDFP-F16
|
| Length |
9.9 mm
|
9.6645 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Number of Functions |
6
|
6
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Propagation Delay (tpd) |
70 ns
|
110 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
2.032 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3.9 mm
|
6.604 mm
|
| Base Number Matches |
1
|
5
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
DIP16,.3
|
| Schmitt Trigger |
|
NO
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TC4050BFN(TP2) with alternatives
Compare CD4050BMW with alternatives