TC4077BFN vs HEF4077BTD-T feature comparison

TC4077BFN Toshiba America Electronic Components

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HEF4077BTD-T Philips Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP PHILIPS SEMICONDUCTORS
Part Package Code SOIC
Package Description SOP, SOP, SOP14,.25
Pin Count 14
Reach Compliance Code unknown unknown
Family 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e2 e4
Length 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type XNOR GATE XNOR GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 280 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN COPPER/TIN SILVER Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm
Base Number Matches 1 2
Rohs Code Yes
HTS Code 8542.39.00.01
Max I(ol) 0.00035999999999999997 A
Package Equivalence Code SOP14,.25
Packing Method TR
Prop. Delay@Nom-Sup 150 ns
Schmitt Trigger NO

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