TC427MJA
vs
TC427EPAG
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TELEDYNE COMPONENTS
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
DIP-8
|
PLASTIC, DIP-8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| High Side Driver |
NO
|
YES
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-30 Code |
R-GDIP-T8
|
R-PDIP-T8
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
TOTEM-POLE
|
|
| Output Peak Current Limit-Nom |
1.5 A
|
1.5 A
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
12 mA
|
|
| Supply Voltage-Max |
18 V
|
18 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Turn-off Time |
0.12 µs
|
0.12 µs
|
| Turn-on Time |
0.075 µs
|
0.075 µs
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
| JESD-609 Code |
|
e3
|
| Length |
|
9.5 mm
|
| Package Code |
|
DIP
|
| Seated Height-Max |
|
5.08 mm
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare TC427MJA with alternatives
Compare TC427EPAG with alternatives