TC500ACOE713
vs
TC500CJE
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
TELCOM SEMICONDUCTOR INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDIP-T16
|
| Number of Terminals |
16
|
16
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Package Description |
|
0.300 INCH, MS-030, CERDIP-16
|
| Pin Count |
|
16
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e3
|
| Length |
|
19.3 mm
|
| Neg Supply Voltage-Max (Vsup) |
|
-7.5 V
|
| Neg Supply Voltage-Min (Vsup) |
|
-4.5 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-5 V
|
| Number of Functions |
|
1
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP16,.3
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Current-Max (Isup) |
|
2.5 mA
|
| Supply Voltage-Max (Vsup) |
|
7.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare TC500CJE with alternatives