TC500ACPE
vs
TC500IOE713
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
TELCOM SEMICONDUCTOR INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
DIP-16
|
0.300 INCH, PLASTIC, MS-013, SOIC-16
|
| Reach Compliance Code |
unknown
|
compliant
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e3
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
SOP16,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max (Isup) |
2.5 mA
|
2.5 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| HTS Code |
|
8542.39.00.01
|
| Length |
|
10.3 mm
|
| Moisture Sensitivity Level |
|
1
|
| Neg Supply Voltage-Max (Vsup) |
|
-7.5 V
|
| Neg Supply Voltage-Min (Vsup) |
|
-4.5 V
|
| Number of Functions |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
2.64 mm
|
| Supply Voltage-Max (Vsup) |
|
7.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
7.49 mm
|
|
|
|
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